Laser Dot Pattern System
UV Laser Precision Micromachining System
MOQ ： piece
Lead Time ： Days
Seller Support : Trade Authenticity Guaranteed & Accepting
Payment : L/C，T/T，Western Union, Money Gram, Credit Card, Paypal
Product details
Supply Ability
- Warranty(Year)：1 Year
Product Specifications
Product Description
With strong technical capability and process experience, Delphilaser successfully developed a new generation high-end laser system. This system delivers high performance in cutting, drilling and surface treatment in glass, Ceramic, Sapphire, Silicon, Cu, Alloys and Organic Films with high throughput, good quality and flexibility.
Specifications:
Wavelength : 355nm
Pulse width : 8-15ns
Average power : 3W\6W\8W
Pulse energy stability : <3%rms
Maximum aspect ratio : 4:1
Minimum diameter : 70um
Features :
1. High efficiency, high stability
2. Small thermal effect, excellent in shape
3. Suitable for a variety of graphics formats
4. High density drilling
Applications :
Main applications in micro-drilling, cutting on glass, Ceramic, Sapphire, Silicon, Cu, Alloys and organic films, especially on hard and brittle materials such as glass, Ceramic, Sapphire,etc.
Wavelength : 355nm
Pulse width : 8-15ns
Average power : 3W\6W\8W
Pulse energy stability : <3%rms
Maximum aspect ratio : 4:1
Minimum diameter : 70um
Features :
1. High efficiency, high stability
2. Small thermal effect, excellent in shape
3. Suitable for a variety of graphics formats
4. High density drilling
Applications :
Main applications in micro-drilling, cutting on glass, Ceramic, Sapphire, Silicon, Cu, Alloys and organic films, especially on hard and brittle materials such as glass, Ceramic, Sapphire,etc.
You May Like
You May Like
-
Laser Dot Pattern System
-
UV Laser Precision Micromachining System
-
Picosecond Laser Precision Micromachining System
-
Fiber Laser Cutting System
-
General series laser marking machine
-
TM Laser Marking System
-
TI Laser Marking System
-
UV Laser Wafer Scribing System
-
ITO Laser Etching System
-
Glass Cutting System
